Main Page | See live article | Alphabetical index A Dual-Inline Package (DIP) is a specific style of electronic component wherein the electrical connections to the package are arranged in two rows of leads that use industry-standard spacings. The Dual-Inline Package is designed to package components that are mounted on a printed circuit board. JEDEC-standard DIPs have the inter-lead spacing specified as 0.1" and the row spacing is specified at 0.3". This article is from Wikipedia. All text is available under the terms of the GNU Free Documentation License.